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Memory Product Part Numbers
Memory IC (MOS integrated circuit)
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MCP (Hybrid integrated circuit)
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<1> Part number code
<2> Package code
<3> Derivation classification or ROM code
<4> Detailed package classification code (only some products)
<1> Part number code
This number is unique to each product. It may also indicate the memory product type, density, I/O number, or revision.
Part number code indicating memory product type:
µPD23C128000BL (Mask ROM)
µPD29F064115 (Flash Memory)
µPD431000A (SRAM (4 transistor memory cell))
µPD442000A (SRAM (6 transistor memory cell))
µPD4632312 (Mobile Specified RAM (may also indicate some SRAM products))
µPD485505 (specific-application memory such as Line Buffer)
MC-2C24104 (MCP)
Part number code indicating density (not applicable to some products):
µPD29F256115 (256M bit)
µPD23C128080BL (128M bit)
µPD4664312 (64M bit)
µPD44323362 (32M bit)
µPD44164082 (16(18)M bit)
µPD448012 (8M bit)
µPD444001 (4M bit)
µPD432232L (2M bit)
µPD431000A (1M bit)
Part number code indicating I/O number (applicable to SRAM products (except Low Power SRAM)):
µPD444001 (x1 bit)
µPD444004 (x4 bit)
µPD444008 (x8 bit)
µPD444016 (x16 bit)
µPD44321182 (x18 bit)
µPD4481322 (x32 bit)
µPD44321362 (x36 bit)
Part number code indicating revision (revisions are indicated by the letters A, B, and J, in that order):
µPD431000A
µPD43256B
µPD23C64000JL
<2> Package code
The main package codes used for memory products are shown below.
µPD431000ACZ (DIP (15.24mm width))
µPD44323182F1 (Plastic BGA (Wire bonding))
µPD44165082F5 (Plastic BGA (Flip chip))
µPD4664312F9 (Tape BGA (Wire bonding))
µPD4416008G5 (TSOP(II) (10.16mm width))
µPD44322181GF (LQFP (14x20mm width))
µPD43256BGU *1 (TSOP(I) (11.43mm width))
µPD431000AGW (SOP, TSOP(I) (13.4mm width))
µPD23C64000JLGX (SOP (15.24mm width))
µPD448012GY (TSOP(I) (18mm width))
µPD29F064115GZ (TSOP(I) (20mm width))
µPD444016LLE (SOJ (10.16mm width))
Note(*)
- TSOP(I) (13.4mm width) for µPD431000AGU
<3> Derivation classification or ROM code
Indicates specifications such as the operating voltage, speed grade, and operating temperature range. (For Mask ROM products, this number indicates the ROM code.)
Operating voltage
Indicated by the first letter of the derivation classification code. This may not apply to some products.
µPD444016LE-8 (5V operation product: No letter)
µPD444016LLE-A8 (3.3V operation product)
µPD444012AGY-B55X (3.0V operation product)
µPD44323182F1-C40 (2.5V operation product)
µPD29F256115F9-E85X (1.8V operation product)
Speed grade
Indicates the access time or cycle time as a 2-digit number.
µPD444016LLE-A12 (Access time 12ns)
µPD4482181GF-A65 (Access time 6.5ns)
µPD4482182GF-A50 (Cycle time 5.0ns)
Operating temperature range
Indicated by the last letter of the derivation classification code.
µPD444012AGY-B55X (Operating temperature range -25 to +85°C)
µPD4482182GF-A50Y (Operating temperature range -40 to +85°C)
<4> Detailed package classification code (only some products)
Used for some products to indicate the package in more detail, such as lead form and BGA shape.
Lead form classification
µPD43256BGW-B15-9JL (Normal bent lead)
µPD43256BGW-B15-9KL (Reverse bent lead)
BGA shape classification
Based on length of short edge.
µPD44165082F5-E50-EQ1 (Short edge = 12mm or 13mm)
µPD44323182F1-C50-FJ1 (Short edge = 14mm or 15mm)
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